German semiconductor equipment maker Tresky Automation has launched an active alignment technology aimed at boosting precision in the packaging and interconnection of high-integration photonics systems, as Europe seeks to strengthen its position in critical optoelectronic technologies.
The Hennigsdorf-based company, a specialist in die bonding and microelectronics assembly, said its new platform allows for nanometre-level accuracy by using real-time optical feedback to maximise coupling efficiency during component alignment.
“Our machines are not only precise, but they also think ahead,” said Daniel Schultze, Managing Director of Tresky GmbH. “Active alignment means real-time correction, optical feedback and maximum yield. Once you’ve worked with it, you’ll never want to go back.”
Active alignment differs from conventional passive alignment by adjusting the positioning of optical components based on performance feedback rather than geometric reference points.
The method ensures optimal light coupling efficiency, particularly in applications involving single-mode fibres and silicon photonics, where even minimal misalignments can cause significant performance losses.
The technology is increasingly relevant for safety-critical systems including fibre-optic communication networks, autonomous vehicles, and aerospace platforms. Optical transceivers in satellites, LiDAR systems, and quantum sensors all depend on stable, low-loss coupling between optical components.
Tresky’s systems support a variety of coupling processes, including edge, grating, lensed fibre and free-space coupling. Edge coupling, for instance, enables low-loss connections—typically below 1 dB—by feeding light directly into the edge of a photonic chip, while grating coupling allows vertical light input via structured surfaces, offering greater tolerance and flexibility for wafer-level testing.
The company’s modular machine platforms integrate bonding, curing, optical and electrical pre-testing, and automated assembly of fibres, lenses and laser diodes. They are designed to accommodate both research and high-volume production needs.
Schultze said Tresky’s latest die bonders combine multiple bonding technologies, such as thermocompression, adhesive, ultrasonic, sintering and flip-chip bonding, into a single platform. “These universal systems make Tresky unique on the market and offer maximum flexibility without compromising precision or process reliability,” he said.
The introduction of active alignment comes as European policymakers and industry leaders push to reduce dependency on non-European suppliers in advanced photonics and semiconductor manufacturing.
Tresky will showcase its active alignment platform and full range of die bonding solutions at productronica/SEMICON Europe in Munich from 18th to 21st November, at booth 321 in Hall B2.
Founded in 2013, Tresky Automation develops and manufactures its equipment at its headquarters near Berlin, where it serves clients across research, industrial and defence sectors.
