STI’s Engineering Services division will feature its custom manufacturing for the defense sector, as well as counterfeit detection. Additionally, the Microelectronics Lab specializes in state-of-the-art engineering design and assembly including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT®).
The Engineering Services division is a multifaceted technical organization whose common goal is to provide engineering support in the field of small to medium volume electronics manufacturing as well as microelectronics and hybrid assemblies in a certified class 1000 cleanroom. STI also specializes in military contract electronics assemblies and failure analysis. From product design and manufacturability analysis to pre-production prototype and development, STI’s Engineering Services division is equipped to support its customers.