Head-in-Pillow component soldering defects are a growing problem in the industry and are typically related to component and/or board warpage. There are increasing developments of solder paste to help mitigate the effect. The session will discuss the test methodologies to create and quantify Head-in-Pillow defects as well as potential material/process solutions to minimize them.
Results will be discussed on the redesign of components to control warpage during reflow. Information on developing iNEMI projects on qualification requirements and primary factors affecting component warpage during reflow will be presented in relation to the JEDEC standard.