Texas Instruments (TI) has introduced a multiprotocol communications module and dual-channel IO-Link master designed to simplify connectivity between industrial equipment and factory control systems.
The new devices are intended to reduce the hardware and development complexity associated with connecting diverse equipment across industrial networks, where manufacturers often need to support multiple communication protocols.
The TICS100MOD system-on-module (SoM) supports EtherCAT, EtherNet/IP and Profinet on a single hardware platform. Engineers can switch between the three protocols through firmware updates, avoiding the need to redesign hardware when network requirements change.
TI describes the module as the industry’s smallest fully featured, multiprotocol communications SoM. Built around the company’s AM2612 microcontroller and DP83826AI Ethernet physical layer, it incorporates two Arm Cortex-R5F cores and external memory to support protocol stacks and industrial automation applications.
The second device, the TIOM2212, is a dual-channel IO-Link master designed to connect sensors and actuators to higher-level Industrial Ethernet networks. It combines analogue integration and built-in protection features to support data exchange between field devices and factory control systems.
Compatible with TI’s Sitara industrial networking system-on-chips and AM13Ex real-time microcontrollers, the device uses an integrated frame handler to simplify the connection between IO-Link devices and industrial networks.
The launch reflects a broader challenge for connected factories, where equipment from different manufacturers and generations must exchange data across multiple communication standards. Supporting these networks can require separate hardware and software for each protocol, adding cost and extending development times.
TI’s approach combines programmable hardware with certified software stacks, allowing engineers to implement different industrial communication protocols on a common platform. The company also provides development kits, application examples and troubleshooting tools through its industrial communications software development kit.
At the centre of its multiprotocol architecture is TI’s programmable real-time unit and industrial communication subsystem (PRU-ICSS), which handles deterministic, low-latency communications. Offloading these tasks from the general-purpose Arm processors allows them to manage other system functions.
The addition of the TIOM2212 also extends TI’s IO-Link portfolio, which spans transceivers, digital output switches and master devices.
“Industrial communication is evolving faster than ever, and engineers need a partner who can help them adapt to emerging standards and requirements,” said Karim Jamal, Director of Industrial Communications Solutions at TI.
The company cited SICK as an example of a customer using its industrial communication technology. Dr Stefan Odermatt, senior vice president of research and development, integrated automation at SICK, said TI’s Industrial Ethernet and IO-Link solutions supported the development of products including its SIG300 sensor integration system.
The TICS100MOD is expected to become available by the end of 2026, while preproduction quantities of the TIOM2212 are available now through TI’s website.
