Session 6, chaired by Jeff Kennedy of Celestica, will discuss the necessity of conformal coating for protecting fine circuits from harsh environments. Conformal coatings provide adequate protection to a certain environment only when applied correctly and film integrity is achieved. Film integrity can be characterized by even film thickness and minimal defects in the film, especially over or around conductors and coating adhesion. Most issues relating to coating thickness and defects are related to application and material compatibility. Defects like de-wetting, capillary flow and delamination also are typically related to surface contaminants remaining on the electronic assembly; more specifically nonionic contaminants and thus the integrity of the film is compromised which will have implications on reliability. The following presentations will be held during Session 6:
• Rakesh Kumar will discuss advances in conformal coating adhesion solutions.
• Jason Keeping of Celestica will discuss critical considerations for conformal coating reliability.
• Rich Kraszewski of Plexus Corporation will discuss the implementation of 2-part urethane materials and processes for conformal coating printed circuit assemblies.
Following session 6, the speakers from both conformal coating sessions will serve as panelists with the goal of collaborating with session participants on best practices for conformal coating electronic assemblies.
For more information about the conference, visit http://www.ipc.org/calendar/2010/cleaning-coating-conference-1110/cleaning-coating1110-full-brochure.htm or http://www.smta.org/education/symposia/symposia.cfm#cleaning.