The easy-to-use system is the ideal solution for checking BGA solder balls. The handheld system provides fast and accurate inspection of the soldered points and surface of BGAs, and features a conductive body for ESD. It also enables visual inspection of QFP leads as well as chip parts. As an additional benefit, the small checker (50 x 30 x 15 mm, weighing 25 g) fits in a handy pocket and comes standard with a wrist strap for convenience.
The PR1 is capable of inspecting the interior section of BGA packages using a battery-powered white-LED lighting system. With an expanded lens, the PR1 is capable of up to 7X magnification.